HID-Prelaminates-and-Inlays-Data-Sheet
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APPLICATION AREAS:
HID Global meets the needs of manufacturers producing ID and payment cards for access management, public transportation fare collection, and cashless payment systems. They are ideal for loyalty programs, point-of-sale, ATM and EMV cards as well as NFC applications.
STANDARD AND CUSTOM CONFIGURATIONS TO FIT ANY SPECIFICATION, FROM THE LEADER IN HIGH QUALITY PRELAMINATES
- Application compatibility Specify one or combine multiple integrated chips or use chipless inlays
- Form factor adaptability Inlays of virtually any dimensions, in multiple material options and colors
- Custom designed or manufactured Global expertise and innovation to create the optimal solution
HID Global Prelaminates include durable layers, in a variety of materials, which ensure protection of embedded electronics. These ultra-thin layers are optimized to extend credential life by withstanding mechanical wear and frequent use. Chipless dual interface inlays from HID Global are CQM certified, therefore ideal for EMV card production.
Expertise and innovation have established HID Global as a worldwide leader in the manufacturing of radio frequency identification (RFID) technology. With our Prelaminate sheets or chipless Inlays, this expertise is embedded in any RFID enabled card you make. Prelaminates and inlays may be customized to fit an existing scheme for single or multi-technology applications.
Prelaminates are ideal for manufacturers producing cards or tags for access management, public transportation, retail, loyalty, NFC, and cashless payment applications. We can tune antennas and design custom size and thickness to enable optimized ISO card or non-ISO card form factors.
Patented wire transfer or wire embedding technology assures optimal performance of the antenna and RFID transponder. A variety of integrated circuits are available to suit a broad range of uses. Our technical support services team can help integrate specialized chips, or develop custom antenna designs to fit your manufacturing and application needs. Patented LF and HF DBond™ technology ensures highly durable chip-antenna connections and allows ultra thin prelaminates for perfect printing results without visible chip on the finished card.
SPECIFICATIONS
| Prelaminates | |||||
|---|---|---|---|---|---|
|
Single-Frequency
Multi-Frequency |
|||||
| Base Model Number | Specific to customer format & thickness requirement | ||||
| ELECTRONIC | |||||
| Operating Frequency | 125 kHz | 13.56 MHz | 860 to 960 MHz | 13.56 MHz | 125 kHz, 13.56 MHz or UHF |
| Chip Type |
EM4102, Q5,
ATA5577, Hitag S |
MIFARE Ultralight,
MIFARE Hospitality, MIFARE Classic, MIFARE Plus, MIFARE DESFire, SmartMX, NTAG, ICODE, LEGIC Prime, LEGIC Advant, Calypso, Cipurse, KIAT ™, Vigo™, HID Trusted Tag™, SLE66R35R, EM NF48K, EM4830 chip families |
Monza 4QT/R6;
UCODE DNA/City |
Dual Interface
(no chip) |
Combine
multiple chips per unit |
| Memory |
up to 2048 bit
EEPROM |
48 byte to 140 KB
EEPROM |
up to 224 bit EPC + up
to 3 kbit user memory |
Based on requirements | |
| Modules |
Patented DBond™
technology (Hitag) |
All standard modules
or DBond™ technology |
n/a | ||
| PHYSICAL | |||||
| Dimensions |
Up to 26 in x 20.8 in
Up to 30.3 in × 24.8 in (770 mm × 630mm) (660mm x 530mm) |
||||
| Format | Custom format for ID1 or other shapes | ||||
| Thickness varies by materials and chips | 410 μm to 500 μm | 190 μm to 500 μm | 290 μm to 500 μm | 150 μm to 410 μm |
Based on
requirements |
| Thickness over IC Module | n/a | 191 μm to 500 μm |
Based on
n/a modules |
||
| Housing Materials | PVC, PETG, PC, synthetic paper, Teslin® | ||||
| Colors | Standard white; available transparent or custom colors & e-window option | ||||
| CHEMICAL & MECHANICAL | |||||
| Water | 50% relative humidity for storage, +/- 10% | ||||
| THERMAL | |||||
| Storage | 73° F (23° C , +/- 3°C) | ||||
| Operating | Based on requirements and chip selected | ||||
| Shock/Fatigue | Based on requirements and chip selected | ||||
| OTHER | |||||
| Standards | ISO 7810, ISO 7816, optional NFC | ||||
| n/a |
ISO 14443 or ISO 15693
depending on chip |
EPC C1G2,
ISO 18000-6 |
Based on requirements,
optional NFC |
||
| Options | Layout; material; color; transparency; other chips; customized card size (CR100, XL, XXL) | ||||
| Certifications |
ISO 9001:2015, MasterCard®
CQM certification, Industry-specific product certifications |
||||
| Warranty | 1 year | ||||
requirements for chip type, dimensions, programming and materials.
hidglobal.com
North America: +1 512 776 9000 Toll Free: 1 800 237 7769
Europe, Middle East, Africa: +44 1440 714 850
Asia Pacific: +852 3160 9800 Latin America: +52 55 5081 1650
©2019 HID Global Corporation/ASSA ABLOY AB. All rights reserved.
HID, HID Global, the HID Blue Brick logo, the Chain Design, iON, PolyGuard, UltraCard, Direct-to-Card, iCLASS, iCLASS SE, Seos, MIFARE DESFire, MIFARE Plus, MIFARE Classic, EasyLobby, Asure ID, Workbench, SmartScreen, Color Assist and FARGO are trademarks or registered trademarks of HID Global or its licensor(s)/supplier(s) in the US and other countries and may not be used without permission. All other trademarks, service marks, and product or service names are trademarks or registered trademarks of their respective owners.
2019-12-05 HID-rfid-ci-prelaminates-family-ds-en PLT-04823
